Job Description:

• New IC Package Development for assigned Business Unit(s) including MEMS & Sensor package development for consumer, industrial, automotive, or medical applications
• Literature survey and industry benchmarking on current state-of-the-art package structures, processes, and materials
• Work with cross functional teams in US, Europe, and Asia to provide new IC Package solutions to Business Units
• Work with Business Units to understand product function, application, and reliability & cost requirements
• Propose new package structures and/or materials to achieve target requirements
• Work with OSATs on package feasibility, risk assessment, DOE, and characterization
• Complete package qualification and transfer to Production Sustaining team

Qualifications:

• MS or Ph.D. in Materials Science, Physics, Chemistry, Mechanical Engineering or similar disciplines
• Solid engineering physics background
• 5+ years of traditional packaging experience such as wafer backgrind, dicing, die attach, flip-chip, wafer bumping, wire bond, encapsulation, underfill, molding, ball attach, gels for environmental protection, package singulation, Board Level reliability etc
• 5+ years of experience in supplier/OSAT management, NPI, and HVM
• MEMS & Sensor Packaging experience a plus
• Ability to deep dive into new problems and propose solutions
• Research oriented mindset with a bias for action