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Staff Package Development Engineer



Marketing & Communications, Product
Austin, TX, USA · California, USA · Remote
Posted on Friday, August 25, 2023

Job Description:

  • New IC Package Development for assigned Business Unit(s) including MEMS & Sensor package development for consumer, industrial, automotive, or medical applications
  • Literature survey and industry benchmarking on current state-of-the-art package structures, processes, and materials
  • Work with cross functional teams in US, Europe, and Asia to provide new IC Package solutions to Business Units
  • Work with Business Units to understand product function, application, and reliability & cost requirements
  • Propose new package structures and/or materials to achieve target requirements
  • Work with OSATs on package feasibility, risk assessment, DOE, and characterization
  • Complete package qualification and transfer to Production Sustaining team


  • MS or Ph.D. in Materials Science, Physics, Chemistry, Mechanical Engineering or similar disciplines
  • Solid engineering physics background
  • 5+ years of traditional packaging experience such as wafer backgrind, dicing, die attach, flip-chip, wafer bumping, wire bond, encapsulation, underfill, molding, ball attach, gels for environmental protection, package singulation, Board Level reliability etc
  • 5+ years of experience in supplier/OSAT management, NPI, and HVM
  • MEMS & Sensor Packaging experience a plus
  • Ability to deep dive into new problems and propose solutions
  • Research oriented mindset with a bias for action