Job Description:

• New IC Package Development for assigned Business Unit(s) including MEMS & Sensor package development for consumer, industrial, automotive, or medical applications.
• Literature survey and industry benchmarking on current state-of-the-art package structures, processes, and materials
• Work with cross functional teams in US, Europe, and Asia to provide new IC Package solutions to Business Units
• Work with Business Units to understand product function, application, and reliability & cost requirements.
• Propose new package structures and/or materials to achieve target requirements.
• Work with OSATs on package feasibility, risk assessment, DOE, and characterization
• Complete package qualification and transfer to Production Sustaining team

Qualifications:

• MS or Ph.D. in Materials Science, Physics, Chemistry, Mechanical Engineering, or similar disciplines
• Solid engineering physics background
• 5+ years of traditional packaging experience such as wafer, back grind, dicing, die attach, flip-chip, wafer bumping, wire bond, encapsulation, underfill, molding, ball attach, gels for environmental protection, package singulation, Board Level reliability etc.
• 5+ years of experience in supplier/OSAT management, NPI, and HVM
• MEMS & Sensor Packaging experience a plus
• Ability to deep dive into new problems and propose solutions.
• Research oriented mindset with a bias for action

Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, Twitter, YouTube, and Instagram.

Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders.

We are committed to creating a diverse culture where everyone is included and feels a sense of belonging. For more information, please read our Diversity & Inclusion Statement.